Wafer specifications:
- Size: 4”, 6”, 8” and 12” diameter wafers
- Type: <100> orientation
- Thickness: 350 ± 50 µm, 650 ± 50 µm, 725 ± 25 µm, 735 ± 15 µm, 750 ± 25 µm, 750 ± 5 µm, and 900 ± 50 µm
- Resistivity: 20 to 30 Ohm-Cm
- Dopant: Phosphorous/Boron (P/B)
- Edge Profile: 181 or 242 micron
- Particles: 30@0.2 µm size particles per 8” wafers
- Polish Sides: Single or double sides Polished
- Oxide Growth: 1, 5, 10 and 15 µm thickness
Solexir will accept order for any customized test wafers
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