Solexir Post CMP-130Ce-Zr cleaner is a strong acidic cleaning solution, capable of dissolving all Cerium and Zirconium slurry particles extremely fast.


Cleaning Cerium or Zirconium slurry particles after CMP process.  For more information, please contact us.

Cleaning process:

  • Process temperature is at room temperature
  • Process time will be 1 to 2 min depending on concentration of acid and particle population
  • Wafers or disks must first be rinsed with Di-water to remove all loose particles, then they can be exposed to CMP-130Ce-Zr
  • After the above post CMP cleaning process, rinse wafers or disks very well with Di-Water.
  • Lastly, Post CMP-110Si-B can be used which based on the negative zeta potential will remove any ionic particles from wafer or disk surfaces
  • Dry the wafers and disks immediately to eliminate airborne contamination
  • Mechanically agitating the cleaning solution by Sonication is highly recommended.

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