Wafer specifications:

  • Size: 4”, 6”, 8” and 12” diameter wafers
  • Type: <100> orientation
  • Thickness: 350 ± 50 µm, 725 ± 25 µm, 735 ± 15 µm, 750 ± 25 µm, 750 ± 5 µm, and 900 ± 50 µm
  • Resistivity: 0.001- 0.005, 0.005 – 0.02 Ohm-Cm up to 4000 Ohm-Cm
  • Dopant: Phosphorous/Boron (P/B)
  • Edge Profile: 181 or 242 micron
  • Particles: <20@o.2 µm size particles per 8” wafers
  • Polish Sides: Single or double sides Polished
  • Oxide Growth: 1, 5, 10 and 15 µm thickness

Solexir will also offer customized wafers for its customers

 

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