Description:
The Solexir Post CMP-120Al cleaner, is an alkaline solution, capable of changing Al2O3 particles to ionic complex of aluminum Al(OH)4-2 which could then easily be repulsed from the surface, due to the existence of strong negative surface zeta potential.
Application:
Cleaning Aluminum Oxide slurry particles after CMP process. For more information, please contact us.
Cleaning process:
- Process temperature is at room temperature
- Process time will be between 30 sec to 2 min depending on population of particles on the surface
- Wafers or disks must be first rinsed with Di-water to remove all loose particles, then they can be exposed to CMP -120Al.
- After Post CMP cleaning process, rinse wafers or disks very well with Di-Water.
- Dry the wafers and disks immediately to eliminate airborne contamination
- Mechanically agitating the cleaning solution or using a sonication system during cleaning process is highly recommended.
Contact Us!
