Wafer specifications:
- Size: 4”, 6”, 8” and 12” diameter wafers
- Type: <100> orientation
- Thickness: 350 ± 50 µm, 725 ± 25 µm, 735 ± 15 µm, 750 ± 25 µm, 750 ± 5 µm, and 900 ± 50 µm
- Resistivity: 0.001- 0.005, 0.005 – 0.02 Ohm-Cm up to 4000 Ohm-Cm
- Dopant: Phosphorous/Boron (P/B)
- Edge Profile: 181 or 242 micron
- Particles: <20@o.2 µm size particles per 8” wafers
- Polish Sides: Single or double sides Polished
- Oxide Growth: 1, 5, 10 and 15 µm thickness
Solexir will also offer customized wafers for its customers