The spin coating of photoresist, when applying anti-reflective or polyimide coating on microelectronic substrate, often results in the formation of what is known as edge bead. This refers to the unwanted accumulation of the coated material at the outer edges of the substrate in form of a bump. These accumulations may also wrap around the edge of the substrate and as a result may contaminate the back-side edges of the substrate as well. If the edge of wafers are not cleaned, the dried particles or photoresist residues can flak off, causing particle contamination and other problems in subsequent manufacturing and process steps. Consequently, the unwanted residues on the outer reaches of the substrate should be removed by using a stream of high purity solvents to clean and to level the edges to the same thickness as the rest of the substrate surface area. The Solexir-100EBR, is a strong organic solvent capable of cleaning all resides from substrate edges quickly and efficiently.
To address the edge bead phenomenon, Solexir has engineered a series of edge bead removals by utilizing high purity solvents or solvent mixtures. These products feature varying strength, viscosity and evaporation rates that are compatible with all coating equipments, are environmentally friendly without Ethylene Glycol Monomethyl Ether Acetate (EGMEA), and can be tailored to specific type of spin coating materials. By controlling the substrate spins speed, the dispense nozzle’s position, pressure and direction the edge bead will be completely removed by using Solexir EBR products. For more information, please contact us.
- Process temperature is about 20 to 25 degrees C.
- Very fine nozzle spray is needed during cleaning process.